Hosted by the Joint Laboratory for High Density Electronic Packaging Materials and Devices, and co- organized by The Chinese University of Hong Kong (CUHK), Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (SIAT), and Shenzhen Institute of Advanced Electronic Materials (SIEM), The Professional Forum for High Density Electronic Packaging Materials and Devices in the Greater Bay Area, X-Lake Forum 2024 was successfully held on 23 November (Saturday) at The Chinese University of Hong Kong. As one of the sub-forums of the X-Lake Forum 2024, this forum focused on the latest research results and industry trends in the field of electronic packaging materials and devices, and brought together circa a hundred of top experts, scholars and industrial practitioners from the Greater Bay Area to discuss the future development of electronic packaging materials and devices. The forum is demonstrating "production, education, research and application" through various forms such as invited presentations, theme reports, research output displays, enterprise product exhibitions, as well as research institute visits and exchanges, so as to promote the development and application of electronic packaging and related materials. Chaired by Professor Xu Jianbin, Associate Dean of the Faculty of Engineering, Choh-Ming Li Professor of Electronic Engineering, CUHK and Academic Vice President of SIAT, various distinguished guests from the academia and the industry attended the forum, including Dr. Zhang Lin, Director of Shenzhen Science, Technology and Innovation Bureau, Professor Alan K.L. Chan, Provost of CUHK, Prof. Wu Chuangzhi, Secretary of the Party Committee and Vice President of SIAT, Dr. Daniel Shi, Vice President of Hong Kong Applied Science and Technology Research Institute, Prof. Sun Rong, Director of Institute of Advanced Electronic Materials, Professor Tsang Hon-ki, Dean of Faculty of Engineering, CUHK, et al. To had started with the event, Professor Xu extended a warm welcome to the guests, experts and scholars, as well as all participants. “Through exchanges at this forum and the brain storming, a batch of forward-looking and innovative ideas of high-quality development have been inspired. The R&D alliance of Shenzhen-Hong Kong will further accelerate the construction of a high-level talent base, promote technological innovation and the transformation of scientific and technological outputs, advance the deep integration of the innovation chain, industrial chain, capital chain and talent chain, and help the Greater Bay Area become an important innovation powerhouse for the country to participate in the development of the world's advanced manufacturing base,” said Professor Xu. Dr. Zhang Lin, Director of the Shenzhen Municipal Bureau of Science and Technology Innovation, delivered the opening speech. He highlighted that the Guangdong-Hong Kong-Macao Greater Bay Area is one of the world’s most active regions for technological innovation. As the innovation engine of the region, Shenzhen recently achieved a historic milestone at the 26th China High-Tech Fair, with the intended transaction volume surpassing 120 billion RMB, setting a new record. Shenzhen is focusing on the active integration of innovation, manufacturing, and market sectors, deepening reforms in its science and technology system, accelerating the development of major scientific platforms, and promoting the deep integration of innovation chains and industrial chains. These efforts are aimed at building a new development model and establishing Shenzhen as a globally influential hub for technological innovation and a center for emerging industries. Professor Alan Chan, the Provost of CUHK, expressed warm congratulations and heartfelt thanks to the guests. He noted that this event, as an important sub-forum of the Xili Lake Forum, is dedicated to promoting the flow of high-end talent and technological resources within the Greater Bay Area, and to integrating high-quality resources in the field of high-density electronic packaging. He emphasized that CUHK, as a world-leading institution, will continue to strengthen its long-standing strategic cooperation with the SIAT, particularly in the development of the Joint Laboratory for High-Density Electronic Packaging Materials and Devices, and work together to open a new chapter in technological innovation in the Greater Bay Area. Professor Wu Chuangzhi, in his speech, mentioned that SIAT, a research institution jointly established by the Chinese Academy of Sciences, the Shenzhen Municipal Government, and CUHK, owes its achievements to the strong support of both the Shenzhen Municipal Government and CUHK. In the 14th Five-Year Plan, SAIT has identified integrated circuits and materials as one of its three key focus areas. The goal is to leverage the innovation resources of the Greater Bay Area, integrate various research and technological strengths, and make breakthroughs in critical core technologies to meet the nation's major strategic needs. Professor Sun Rong gave a detailed introduction and report on the construction and development of the joint laboratory. With the academic advantages of the Greater Bay Area, as early as 2012, CUHK Faculty of Engineering and SIAT took the lead in developing the pathways of in-depth research collaboration between Hong Kong and Shenzhen, and jointly established the Joint Laboratory for High Density Electronic Packaging Materials and Devices. The Joint Laboratory mainly focuses on the R&D and application technology in the field of high-end electronic packaging materials for ICs, and carries out cutting-edge technology research on electronic materials R&D by bringing together the scientific research advantages of Shenzhen and Hong Kong. Committed to building an innovation and development platform and creating a hub for high-calibre talent, the Joint Laboratory has achieved a number of research landmarks and has been leading several technological innovations, as well as cultivating numerous high-level talents. With warm applause, Professor Alan Chan and Professor Wu Chuangzhi jointly unveiled the "Joint Laboratory Plaque”, looking forward to promoting deep integration of industry, academic and research sectors and cultivating high-calibre research and technological talents in the future. Following the plague unveiling ceremony, the eight distinguished speakers made presentations on their respective research areas and achievements. Through analyzing the research and industrial development strategies of electronic materials from the perspective of industrial development, investment trends, and technological frontiers, the professional presentations bring experience and ideas for the development of the electronic packaging materials industry in the Greater Bay Area. The guests also joined a visit to Hong Kong Science and Technology Park, Hong Kong Applied Science and Technology Research Institute, Hong Kong Institute of Science & Innovation, Chinese Academy of Sciences for exchange. The X-Lake Forum is an international innovation forum jointly launched by the Ministry of Science and Technology and the Shenzhen Municipal Government, with the permanent theme of "Innovation - Sustainable Development". First held in 2021, the X-Lake Forum has gradually become an important R&D forum for the development of an international science and technology innovation center in the Greater Bay Area. With the theme of "Artificial Intelligence Empowering Future Cities and New Quality Productivity", the 2024 X-Lake Forum will hold 1 opening ceremony and main forum, 29 professional forums, and other supporting activities such as campus open day. The successful holding of this forum has not only stimulated new momentum into the development of the electronic packaging industry in the Greater Bay Area, but also built a high-level exchange and cooperation platform for all sectors of the industry. Driven by innovation, The Professional Forum for High Density Electronic Packaging Materials and Devices in the Greater Bay Area will continue to promote the development of an international science and technology innovation center in the Greater Bay Area in the future.
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