The Chinese University of Hong Kong (CUHK) and Tongji University held an inauguration ceremony and signed a cooperation agreement on 8 April for the “CUHK-Tongji University Joint Research Laboratory for Smart Transportation”. Through the laboratory, the two universities will jointly promote research and development in priority fields and key technologies, and carry out collaboration in areas such as innovative talent development, in response to major societal needs in the field of smart transportation.

CUHK’s Vice-Chancellor and President Professor Dennis Lo Yuk-ming led a delegation to the ceremony at Tongji University, including Professor Tsang Hon-ki, Dean of Engineering, and Professor Chen Benmei, Head of the Department of Mechanical and Automation Engineering. Representatives from Tongji University included President Academician Yang Jinlong and Vice President Professor Li Xiangning.

The Department of Mechanical and Automation Engineering at CUHK maintains close collaboration with Tongji University in smart transportation and unmanned systems. A jointly developed amphibious unmanned system capable of operating in both air and water has attracted widespread attention domestically and internationally, and successfully supported China’s Antarctic research mission in February 2026. In addition, a joint CUHK and Tongji University team stood out at the 16th International Micro Air Vehicle Competition (IMAV 2025) in Mexico last year, outperforming more than 10 other elite teams – including from Europe and the US – to win championships in both the indoor and outdoor categories.

The Chinese University of Hong Kong (CUHK) receives approval from the Innovation and Technology Commission (ITC) of the HKSAR Government to establish a new research center, in collaboration with National University of Singapore, under the third InnoHK research cluster, SEAM@InnoHK. This research center, The Center for Heterogeneous Integration and Production (CHIP), is led by Professor Shih-Chi Chen (Director, Department of Mechanical and Automation Engineering, CUHK), Professor Jianbin Xu (Co-Director, Department of Electronic Engineering, CUHK), and Professor Ni Zhao (Associate Director, Department of Electronic Engineering, CUHK).

CHIP is dedicated to advancing next-generation electronics through innovations in semiconductor equipment and material processing, with a focus on advancing heterogeneous integration technologies. As the semiconductor industry moves beyond Moore’s Law, 3D heterogeneous integration has become essential for enhancing the performance and functionality of modern electronics. Constructing silicon 3D-ICs at the nanoscale requires highly precise tools that are currently unavailable, while the integration of emerging semiconductors—such as 2D materials, metal oxides, and mixed ionic–electronic conductors—demands new equipment and scalable fabrication processes.

CHIP’s research is structured into three synergistic research programs, each with a distinct focus and objective: Research Program 1 focuses on developing enabling precision fabrication and metrology equipment, including wafer bonding systems, 2D lithography platforms, and laser etching machines, to set new benchmarks in speed, accuracy, and scalability for 3D and photonic ICs. Research Program 2 focuses on foundational material engineering and advanced packaging solutions, including bonding technology, chip cooling, and 2D material integration, enabling heterogeneous integration at industrial scale. Research Program 3 targets the creation of new devices and systems enabled by heterogeneous integration, including electronic-photonic co-ICs, back-end-of-line (BEOL)-compatible devices, 2D material-silicon hybrid optoelectronic chips, and flexible sensing modules. Together, these programs align closely with the roadmap of global heterogeneous integration development, addressing critical challenges in semiconductor manufacturing while enabling new applications in AI, high-performance computing, robotics, AR/VR, and beyond.

Professor Lu Yi-chun of the Department of Mechanical and Automation Engineering has been awarded the 20th Chinese Young Women in Science Fellowship. This accolade recognises her exceptional contributions to electrochemistry, energy engineering and sustainable battery technology. Professor Lu is one of 19 recipients nationwide and the sole awardee from Hong Kong this year.

Professor Lu received her Bachelor’s degree in Materials Science and Engineering from National Tsing Hua University, Taiwan in 2007 and her PhD in Materials Science and Engineering from the Massachusetts Institute of Technology (MIT) in 2012. Her research focuses on electrochemistry, energy engineering and sustainable battery technology, with key innovations including the development of molecular crowding electrolytes for high-voltage aqueous batteries and the pioneering of the world’s first low-cost, high-power, polysulphide-based flow battery. This battery features a novel charge-reinforce, ion-selective membrane and a biomimetic molecular catalyst. Beyond academic research, Professor Lu is dedicated to commercialising her innovations. In 2020, she co-founded Luquos Energy, a CUHK-incubated startup specialising in scalable, safe, sustainable battery technologies for grid storage. Luquos Energy was named one of the Top 10 Flow Battery Startups to Watch in 2023 by the StartUs Insights Discovery Platform.

About the Chinese Young Women in Science Fellowship

The Chinese Young Women in Science Fellowship, established in 2004 by the All-China Women’s Federation, the China Association for Science and Technology, the China National Commission for UNESCO and L’Oréal (China) Co., Ltd., honours female scientists under 45 who have made significant discoveries and achievements in basic sciences. The fellowship aims to highlight the contributions of women in scientific research, inspire continued engagement in scientific careers and promote fruitful research outcomes.